00823nam a2200205 k 4500001001300000005001500013008004100028041001300069049003200082052001800114056001600132082001700148100004800165245013300213260003600346300002900382502008600411653010000497963002000597KDM20010394920200729172645010222s2001    bnka       FC 000   kor  0 akorbeng0 lEM2242961lEM2242962c2fDP01a578.7236b1-1  a578.7236240 a668.42262211 a배종우,g裵宗佑,d1969-0KAC20170484610a熱的 信賴性이 向上된 에폭시 封持材=xMicroelectronic epoxy encapsulation for high thermal reliability/d裵宗佑  a부산:b釜山大學校,c2001  ax, 183p.:b삽도;c26cm1 a학위논문(박사) --b부산대학교 일반대학원:c화학공학과,d2001  a열적a에폭시a봉지재aMICROELECTRONICaEPOXYaENCAPSULATIONaHIGHaTHERMALaRELIABILITY  a화학공학과