01096nam a2200241 c 4500001001500000005001500015008004100030040001900071041001300090049003000103052002200133056001400155082001900169100004800188245022600236260003600462300003100498502008600529653015700615950002100772963002600793965003500819KDM199108348  19941011220520910821s1991    ulka       AX 000   kor    a011001c0110010 akorbeng0 lEM828159lEM828160c2fDP01a569.91b김789ㅊ  a569.91230 a621.3804142191 a김재열,g金在烈,d1958-0KAC20181718110a超音波를 利用한 半導體 패키지의 微小 缺陷檢出을 위한 畵像處理에 關한 硏究=x(A)study on the image processing of microdefect detection of semiconductor package by ultrasonic wave/d金在烈  a서울:b漢陽大學校,c1991  aviii,91장:b삽도;c26cm1 a학위논문(박사) --b漢陽大學校 大學院:c精密機械工學科,d1991  a초음파a반도체a패키지a미소a결함검출a화상처리aIMAGEaPROCESSINGaMICRODEFECTaDETECTIONaSEMICONDUCTORaPACKAGEaULTRASONICaWAVE1 a비매품b\5200  a정밀기계공학과  a디지탈영상처리시스템