01469cam a22003131i 4500001001300000005001500013007000300028008004100031040003200072041001300104049003100117052001800148056001100166082001400177100004800191245034700239264005600586300004500642336002600687337002900713338002700742500002300769502013500792504003200927546003400959856012400993900002401117900001401141KDM20197607820200730104554ta180710s2018    bnka     m FU 000c  eng    a221028c011012d221028erda0 aengbkor0 lWM966247lWM966248c2fWDP02a621.3b19-528  a5602601a621.32231 a김근주,g金根柱,d1975-0KAC2018L228210aStudy on the terahertz nondestructive testing method for multi-chip package inspection using a resonant slit-type probe with rounded matching structure =x라운드 매칭 구조를 가지는 공진형 슬릿 프로브를 이용한 다중 칩 패키지 검사를 위한 테라헤르츠파 비파괴 검사 방법에 관한 연구 /d김근주 1aBusan :bKorea Maritime and Ocean University,c2018  axiv, 109 pages :billustrations ;c26 cm  atextbtxt2rdacontent  aunmediatedbnc2rdamedia  avolumebnc2rdacarrier  aAdvisor: 전태인1 aThesis(Ph.D.) --bGraduate School, Korea Maritime and Ocean University,cDivision of Electrical and Electronics Engineering,d2018  aBibliography: pages 103-109  aIn English; summary in Korean40uhttp://www.riss.kr/link?id=T14923247nKERISz이 자료의 원문은 한국교육학술정보원에서 제공합니다.10aKim, Geunju,d1975-10a전태인