01366nam a2200289 c 4500001001300000005001500013008004100028040001100069041001300080052002400093245027100117300002200388545002500410545005000435545005000485545007100535653010200606700003300708700002800741700004800769700004800817773013900865900001801004900001801022900001701040900001901057KSI00092433620141006101936140905s2013    ulk           000   kor    a0110010 akorbeng01a431.4705b한597ㅈ00a피로인산구리용액으로부터 전기도금 된 Cu 필름의 특성에 미치는 도금조건의 영향 =xEffect of deposition conditions on properties of Cu thin films electrodeposited from pyrophosphate baths /d신동율,e심철용,e구본급,e박덕용  ap. 19-29 ;c29 cm  a신동율, ㈜심텍  a심철용, 한밭대학교 신소재공학과  a구본급, 한밭대학교 신소재공학과  a박덕용, 한밭대학교 신소재공학과bdypark@hanbat.ac.kr  aFCCLaElectrodepositionaCurrent densityaPyrophosphate bathaResidual stressaCurrent efficiency1 a신동율0KAC2020648694aut1 a심철용0KAC2020692721 a구본급,g具本及,d1959-0KAC2017014591 a박덕용,g朴德龍,d1964-0KAC2016368950 t전기화학회지.d한국전기화학회.gVol.16 No.1(2013년 2월), p. 19-29q16:1<19w(011001)KSE199901118,x1229-1935a16179770810aShin, Dongyul10aSim, Chulyong10aKoo, Bonkeup10aPark, Deokyong