01665nam a2200373 c 4500001001300000005001500013008004100028040001100069041001300080052003000093245030000123246006900423300002400492545006500516545006500581545006500646545002400711545002400735545008400759653005400843700001900897700003600916700002800952700001400980700001400994700004801008773013001056900001601186900001701202900001801219900001901237900001701256900001801273KSI00091571120131217090925131213s2013    ulk           000   kor    a0110010 akorbeng01a530.405b한596ㅎc23(6)00a습식 식각에 의한 실리콘 웨이퍼의 표면 및 전기적 특성변화.n2,p표면거칠기와 전기적 특성의 상관관계 =xChange of surface and electrical characteristics of silicon wafer by wet etching /d김준우,e강동수,e이현용,e이상현,e고성우,e노재승1 aRelationship between surface roughness and electrical properties  ap. 322-328 ;c30 cm  a김준우, 금오공과대학교 신소재시스템공학부  a강동수, 금오공과대학교 신소재시스템공학부  a이현용, 금오공과대학교 신소재시스템공학부  a이상현, ㈜eCONY  a고성우, ㈜eCONY  a노재승, 금오공과대학교 신소재시스템공학부bjsroh@kumoh.ac.kr  aSurface roughnessaResistivityaSi-waferaEtching1 a김준우4aut1 a강동수,d1984-0KAC2018579671 a이현용0KAC2018J19741 a이상현1 a고성우1 a노재승,g盧載承,d1967-0KAC2013258090 t한국재료학회지.d韓國材料學會.g23권 6호(2013년 6월), p. 322-328q23:6<322w(011001)KSE199509224,x1225-056210aKim, Junwoo10aKang, Dongsu10aLee, Hyunyong10aLee, Sanghyeon10aKo, Seongwoo10aRoh, Jaeseung