01075na  a2200229   4500001001300000005001500013007000300028008004100031040001100072041001300083052003000096245010900126300002100235545007600256545008100332653020000413700005300613700001500666773013500681900001500816900001400831KSI00086929120110804123428ta110628s2007    bnk           000   eng    a0110010 aengbkor01a550.5b한462ㅎㅅc9(2)00aThermal stress of semiconductor IC package =x반도체 IC 패키지의 열응력 /dL.J. Ick,eK.B. Kap  ap. 9-14 ;c26 cm  aL.J. Ick, Inha Technical College, Professor, Dept. of Mechanical Design  aK.B. Kap, Inha Technical College, Professor, Dept. of Mechanical Engineering  aIC packagea직접회로 패키지aAdhesive layera접착 층aAdhesive topologya접착 최적화aFinite element analysisa유한 요소 해석aThermo-mechanical failurea열-기계적 파손1 a이정익,g李政益,d1967-0KAC2018310494aut1 aK., B. Kap0 t韓國機械技術學會誌.d한국기계기술학회.g9권 2호(2007년 6월), p. 9-14q9:2<9w(011001)KSE200000182,x1229-604X10aL., J. Ick10a고병갑