01155nam a2200265 c 4500001001300000005001500013008004100028040001100069041001300080052003600093245017400129300002100303545006700324545005700391545004300448653011700491700001900608700001400627700004800641773012800689856002000817900001900837900001600856900001700872KSI00056172520060830094544060821s2003    tjk           000   kor    a0110010 akorbeng01a581.505b대476ㄷc21(4)-21(7)00aSn-Zn계 무연 솔더접합부의 전단강도와 미세구조=xMicrostructures and shear strength of Sn-Zn lead-free solder joints/d김경섭,e양준모,e유정희  ap. 59-64;c30 cm  a김경섭, 여주대학 전자학과bkkseob@mail.yeojoo.ac.kr  a양준모, 하이닉스 반도체 메모리연구소  a유정희, 한국전자통신연구원  a무연 솔더접합부a전단강도a미세구조aSn-ZnaLead-free solderaIntermetallic compoundaFluxaAging1 a김경섭4aut1 a양준모1 a유정희,g柳正熙,d1961-0KAC2018356980 t大韓熔接學會誌.d대한용접학회.g21卷 7號(2003년 12월), p. 59-64q21:7<59w(011001)KSE199508445,x1225-615340u5035415aKd00010aKim, Kyungseob10aYang, Junmo10aYu, Chonghee