00951nam a2200193 c 4500001001300000005001500013008004100028040001100069041001300080052003600093245019100129300002200320545007100342653012600413700005300539773012800592856002000720900001700740KSI00056075820060830094541060819s2003    tjk           000   kor    a0110010 akorbeng01a581.505b대476ㄷc21(1)-21(3)00a고신뢰성 광모듈을 위한 솔더 범프의 전단강도와 시효 특성=xShear strength and aging characteristics in solder bumps for high reliability optical module/d유정희  ap. 97-101;c30 cm  a유정희, 한국전자통신연구원 광통신부품연구센터  a솔더 범프a전단강도aSolder bumpaShear strengthaAgingaIntermetallic compoundaTransmission electron micrograph1 a유정희,g柳正熙,d1961-0KAC2018356984aut0 t大韓熔接學會誌.d대한용접학회.g21卷 2號(2003년 4월), p. 97-101q21:2<97w(011001)KSE199508445,x1225-615340u5035336aKd00010aYu, Chonghee