00998nam a2200217 c 4500001001300000005001500013008004100028040001100069041001300080052003800093245014400131300002100275545006800296545003800364653010200402700005300504700001400557773017300571900001700744900001900761KSI00055178920060810145759060808s2003    ulk           000   kor    a0110010 akorbeng01a569.27405b한488ㅁc10(1)-10(4)00a플립 칩 BGA 솔더 접합부의 열사이클링 해석=xThermal cycling analysis of flip-chip BGA solder joints/d유정희,e김경섭  ap. 45-50;c26 cm  a유정희, 한국전자통신연구원 광모듈구조연구팀  a김경섭, 여주대학 전자과  aFlip chipaCreepaThermal cyclingaFinite element analysisaDarveauxa플립 칩a열사이클링1 a유정희,g柳正熙,d1961-0KAC2018356984aut1 a김경섭0 t마이크로전자 및 패키징학회지.d한국마이크로전자 및 패키징학회.g10권 1호(2003년 3월), p. 45-50q10:1<45w(011001)KSE199900824,x1226-936010aYu, Chonghee10aKim, Kyungseob