01188nam a2200265 c 4500001001300000005001500013008004100028040001100069041001300080052003000093245016800123300002300291545004700314545004700361545004700408653013100455700001900586700004800605700004800653773014600701856002000847900001900867900001800886900001800904KSI00035270920040923160933040917s2001    ulk           000   kor    a0110010 akorbeng01a559.705b대445ㄷc39(8)00a플라즈마 및 RTA 전처리가 Cu 전해도금에 미치는 효과=xEffects of plasma/RTA pretreatment on Cu electroplating/d李翰昇,e金顯洙,e李鍾武  ap. 920-926;c30 cm  a이한승, 인하대학교 재료공학부  a김현수, 인하대학교 재료공학부  a이종무, 인하대학교 재료공학부  a플라즈마aRTAaRapid Thermal AnnealingaPlasma preteatmenta전처리aCua전해도금aElctroplatingaSeed layeraCopper1 a이한승4aut1 a김현수,g金顯洙,d1963-0KAC2014031041 a이종무,g李鍾武,d1950-0KAC2018193310 t대한금속ㆍ재료학회지.d대한금속.재료학회.g39권 8호(2001년 8월), p. 920-926q39:8<920w(011001)KSE200000110,x0253-384740u3235114aKd00010aLee, Han Seung10aKim, Hyun Soo10aLee, Chong Mu