01002nam a2200229 c 4500001001300000005001500013008004100028040001100069041001300080052003000093245015300123300002300276545005300299545005000352653012200402700001900524700003300543773014600576856002000722900001800742900001200760KSI00034342720040923160907040909s2000    ulk           000   kor    a0110010 akorbeng01a559.705b대445ㄷc38(3)00a구리계 리드프레임/EMC 계면의 접착력 측정=xMeasurements of adhesion strength of Cu-based ledfame/EMC interfaces/d李浩嶸,e劉進  ap. 480-487;c30 cm  a이호영, 한국과학기술원 재료공학과  a유진, 한국과학기술원 재료공학과  a구리계a리드프레임a계면aCu-based leadframeaEpoxy molding compoundaAdhesion strengthaMixed mode loading1 a이호영4aut1 a유진,d1950-0KAC2012232660 t대한금속ㆍ재료학회지.d대한금속.재료학회.g38권 3호(2000년 3월), p. 480-487q38:3<480w(011001)KSE200000110,x0253-384740u3234789aKd00010aLee, Ho Young10aYu, Jin