01861nam a2200361 c 4500001001300000005001500013008004100028040001100069041001300080052003100093245018700124300002800311545010900339545010900448545010900557545010900666545010900775653010800884700005300992700001401045700001401059700003601073700004801109700004801157773016901205856001501374900001701389900001801406900001801424900002001442900001901462900001801481KSI00005367920040223132819031112s1999    ulka          000   kor    a0110010 akorbeng01a569.27405b한488ㅁc6(4)00aMCM-D 기판 내장형 수동소자 제조공정=xFabrication process of embedded passive components in MCM-D/d주철원,e이영민,e이상복,e현석봉,e박성수,e송민규  ap. 1-7:b삽도;c26 cm  a이영민, Micro-Electrinics Technology Laboratory Electronics and Telecommunications Research Institute  a이상복, Micro-Electrinics Technology Laboratory Electronics and Telecommunications Research Institute  a현석봉, Micro-Electrinics Technology Laboratory Electronics and Telecommunications Research Institute  a박성수, Micro-Electrinics Technology Laboratory Electronics and Telecommunications Research Institute  a송민규, Micro-Electrinics Technology Laboratory Electronics and Telecommunications Research Institute  aMCM-Da기판내장형a수동소자a제조공정aFabricationaProcessaEmbeddedaPassiveaComponents1 a주철원,g朱哲源,d1954-0KAC2017074944aut1 a이영민1 a이상복1 a현석봉,d1969-0KAC2017114841 a박성수,g朴性洙,d1961-0KAC2018461571 a송민규,g宋敏圭,d1964-0KAC2013293720 t마이크로전자 및 패키징학회지.d한국마이크로전자 및 패키징학회.g6권 4호(1999년 12월), p. 1-7q6:4<1w(011001)KSE199900824,x1226-936040u3347816aK10aJu, Chul-Won10aLee, YoungMin10aLee, Sang Pok10aHyun, Seok-Bong10aPark, Seong-Su10aSong, Min Kyu