01074nam a2200265 c 4500001001300000005001500013008004100028040001100069041001300080052002300093245013900116300002300255545004700278545004700325545004700372653007500419700005300494700001400547700004800561773012400609856002100733900001900754900001700773900001800790KSI00003751920040205103752031103s2002    tgk           000   kor    a0110010 akorbeng01a569.805b한536ㅅ00a부착방지를 위한 새로운 표면 개질 물질=x(A)new organic modifiers for anti-stiction/d김봉환,e전국진,e이윤식  ap. 102-110;c26 cm  a김봉환, 서울대학교 전기공학부  a전국진, 서울대학교 전기공학부  a이윤식, 서울대학교 응용화학부  a부착방지a표면개질물질aAnti-stictionaNew organic modifiers1 a김봉환,g金奉煥,d1970-0KAC2014001724aut1 a전국진1 a이윤식,g李潤植,d1952-0KAC2014282450 t센서학회지.d한국센서학회.g11권 2호(2002년 3월), p. 102-110q11:2<102w(011001)KSE199508532,x1225-547540u30005505aKd00010akim, Bong Hwan10aChun, Kukjin10aLee, Yoon Sik